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[PVS] System on Chip Conference (SOCC2012) - Final Call for Participation - September 12 - 14, 2012



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              *** FINAL CALL FOR PARTICIPATION ***

       25th  IEEE International SoC Conference (SOCC2012)

                    September 12 – 14, 2012
Sheraton at the Falls/Niagara Convention Center, Niagara Falls, NY, USA

      

        Sponsored by IEEE Circuits and System Society

DISTINGUISHED SPEAKERS:

                                KEYNOTE
          “Driving Innovation in the "Post-Silicon" World”
    Bernard S. Meyerson,  IBM Fellow, Vice President, Innovation &
    Global University Relations, IBM Systems and Technology Group

                                PLENARY
             “Low power solutions for a smarter future”
      Richard Grisenthwaite, ARM Fellow, VP of Technology, ARM,

             “Era of SoCs: Challenges and Opportunities”
   Raj Yavatkar, Intel Fellow, Director, Intel Architecture Group

    “Connectivity Driven Systems: On-Chip, Off-chip and In-between”
 Robert Geer, VP for Academic Affairs & Chief Academic Officer, CNSE,

 EMBEDDED TUTORIALS
- “Intellectual Property Protection and Security”
           S.Kolay, Indian Statistical Institute
- “Neuromorphic Computing: A SoC Scaling Path for the Next Decade”
           Y.Chen, Q.Wu, Air Force Research Lab
- “Exploiting Memristive Device Behavior for Emerging Digital Logic and Memory Applications”
           G.Rose, Air Force Research Lab
- “Massive Parallel Neuromorphic Computing Model for Intelligent Text Recognition”
           Q.Qiu, Syracuse University
- “Memristor in Neuromorphic Computing”
           H.Li, Poly-NYU

Please visit the conference web site http://www.ieee-socc.org or contact
the SoC Conference office at info@xxxxxxxxxxxxx for more information.

ORGANIZING COMMITTEE
Conference General Chair:    Ramalingam Sridhar, Univ at Buffalo
Technical Program Chair:    Norbert Schuhmann, Fraunhofer IIS
Technical Program Co-Chair: Kaijian Shi, Cadence Design Systems
Tutorial Chair:             Nagi Naganathan, LSI Corp
Steering Committee Chair:   Andrew Marshall, Texas Instruments Inc.
Europe Liaison:             Sakir Sezer, Queen’s Univ. Bellfast
Asia Liaison:               Sao-Jie Chen, National Taiwan University

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