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[PVS] CFP - 23rd IEEE International SoC Conference (SOCC 2010)


Please accept our apology if you receive multiple copies of this CFP


               *** CALL FOR PAPERS ***


3 WEEKS TO GO  -  Final Submission Deadline: 19 April 2010


23rd IEEE International SoC Conference (SOCC 2010)


Sponsored by IEEE Circuits and System Society


September 27-29, 2010

Bally’s Las Vegas – Nevada – USA
The SOC Conference provides a premier forum for sharing advances in SoC
technologies and applications in the areas of digital systems, circuit
architectures, design methods, tools and automation, manufacturing
and test, and emerging MEMS and nano technologies.
The 23rd SOCC will be held in Las Vegas, Nevada, and will offer three days
of technical papers, technical workshops, and a vendor exhibition. Please check
our website regularly for updates.
Electronic paper submissions require a full paper in pdf format,
limited to four double-column IEEE format pages, and including
figures and references. SOCC 2010 also welcomes workshop and
tutorial proposals in the related areas of SoC.

A proposal with title, a half-page summary, and speaker's short bio
should be submitted to the Workshop Chair by April 26, 2010. For
corporate sponsorship and exhibition, please contact the SoC
Conference office. The SOCC proceedings will be published by
the IEEE Xplore®. Papers are invited which address new and
previously unpublished results in the area of Systems on Chip,
and related topics.


•       Analog, Mixed-Signal and RF Circuits and Systems
•       Digital Signal Processing (DSP) Circuits and Systems (Video,
        Multimedia, Control etc.)
•       Embedded Systems, Multi/Many Core Systems and Embedded
        Memory Technologies
•       Wireline & Wireless Communication Circuits and Systems
•       System Level Design Methodology, EDA and Design Tools for SoC
•       Reconfigurable and Programmable Circuits and Systems, System on
        Programmable Devices (FPGAs)
•       Low-Power Circuits, Systems and Design Methodologies
•       Signal Integrity, Design for Testability and Design Verification
•       Design for Manufacturability, Variation-aware Methodologies
•       Network on Chip (NoC) & Interconnects
Paper submission deadline:          April 19, 2010
Notification of acceptance:         June 11, 2010
Final camera-ready paper due:       June 25, 2010
Conference General Chair:           Thomas Buechner, IBM
Conference Co-Chair:                Andrew Marshall , Texas Instruments
Technical Program Chair:            Ramalingam Sridhar, SUNY Buffalo
Technical Program Co-Chair:         Norbert Schuhmann, FHG IIS
Steering Committee Chair:           Sakir Sezer, Queen’s Univ. Belfast
Publicity Chair:                    Kaijian Shi, Synopsys

Workshop Chair:                     Nagi Naganathan, LSI

Local Committee:                    Venkatesan Muthukumar, UNLV
                                    Emma Regentova, UNLV

Please visit the conference web site http://www.ieee-socc.org
or contact the SoC Conference office at info@ieee-socc.org
for current conference information



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